teleo-codex/domains/manufacturing
m3taversal f63eb8000a fix: normalize 1,072 broken wiki-links across 604 files
Mechanical space→hyphen conversion in frontmatter references
(related_claims, challenges, supports, etc.) to match actual
filenames. Fixes 26.9% broken link rate found by wiki-link audit.

Co-Authored-By: Claude Opus 4.6 (1M context) <noreply@anthropic.com>
2026-04-21 10:21:26 +01:00
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_map.md auto-fix: strip 33 broken wiki links 2026-03-20 16:58:41 +00:00
ASML EUV lithography monopoly is the deepest chokepoint in semiconductor manufacturing because 30 years of co-developed precision optics created an unreplicable ecosystem that gates all leading-edge chip production.md fix: normalize 1,072 broken wiki-links across 604 files 2026-04-21 10:21:26 +01:00
CoWoS advanced packaging is the binding bottleneck on AI compute scaling because TSMC near-monopoly on interposer technology gates total accelerator output regardless of chip design capability.md fix: normalize 1,072 broken wiki-links across 604 files 2026-04-21 10:21:26 +01:00
HBM memory supply concentration creates a three-vendor chokepoint where all production is sold out through 2026 gating every AI training system regardless of processor architecture.md Auto: domains/manufacturing/HBM memory supply concentration creates a three-vendor chokepoint where all production is sold out through 2026 gating every AI training system regardless of processor architecture.md | 1 file changed, 38 insertions(+) 2026-03-27 12:15:00 +00:00
semiconductor fab cost escalation means each new process node is a nation-state commitment because 20B-plus capital costs and multi-year construction create irreversible geographic path dependence.md fix: normalize 1,072 broken wiki-links across 604 files 2026-04-21 10:21:26 +01:00
TSMC manufactures 92 percent of advanced logic chips making Taiwan the single largest physical vulnerability in global technology infrastructure.md fix: normalize 1,072 broken wiki-links across 604 files 2026-04-21 10:21:26 +01:00