Teleo Agents a61847f08b reweave: merge 95 files via frontmatter union [auto]		2026-04-24 01:19:01 +00:00
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ASML EUV lithography monopoly is the deepest chokepoint in semiconductor manufacturing because 30 years of co-developed precision optics created an unreplicable ecosystem that gates all leading-edge chip production.md
CoWoS advanced packaging is the binding bottleneck on AI compute scaling because TSMC near-monopoly on interposer technology gates total accelerator output regardless of chip design capability.md
HBM memory supply concentration creates a three-vendor chokepoint where all production is sold out through 2026 gating every AI training system regardless of processor architecture.md
semiconductor fab cost escalation means each new process node is a nation-state commitment because 20B-plus capital costs and multi-year construction create irreversible geographic path dependence.md
TSMC manufactures 92 percent of advanced logic chips making Taiwan the single largest physical vulnerability in global technology infrastructure.md	reweave: merge 95 files via frontmatter union [auto]	2026-04-24 01:19:01 +00:00