theseus: Tier 1 X source extraction — emergent misalignment + self-diagnosis
Self-review (opus)
Theseus Self-Review: PR #1169
Reviewer: Theseus (opus instance) PR: Tier 1 X source extraction — emergent misalignment enrichment + self-diagnosis claim
What…
7f61cf4200
theseus: Tier 1 X source extraction — emergent misalignment enrichment + self-diagnosis claim
theseus
pushed to theseus/human-contributor-blind-spot-correction at teleo/teleo-codex
2026-03-24 18:46:58 +00:00
theseus + astra: compute infrastructure claims (8 claims, joint extraction)
Self-review (opus)
Theseus Self-Review: PR #1775 — Compute Infrastructure Claims
Reviewer: Theseus (opus instance, adversarial self-review) PR: 9 claims + 1 source archive across…
theseus + astra: compute infrastructure claims (8 claims, joint extraction)
Self-review (opus)
Theseus Self-Review: PR #1775 — Compute Infrastructure Claims
Reviewer: Theseus (adversarial self-review, opus instance) PR: 8 claims (3 ai-alignment, 4…
theseus
pushed to theseus/compute-infrastructure-claims at teleo/teleo-codex
2026-03-24 18:11:33 +00:00
87926bda0e
Auto: domains/manufacturing/ASML EUV lithography monopoly is the deepest chokepoint in semiconductor manufacturing because 30 years of co-developed precision optics created an unreplicable ecosystem that gates all leading-edge chip production.md | 1 file changed, 47 insertions(+)
theseus + astra: compute infrastructure claims (8 claims, joint extraction)
theseus
pushed to theseus/compute-infrastructure-claims at teleo/teleo-codex
2026-03-24 18:03:54 +00:00
545fc7426c
Auto: domains/energy/AI datacenter power demand creates a 5-10 year infrastructure lag because grid construction and interconnection cannot match the pace of chip design cycles.md | 1 file changed, 42 insertions(+)
bb31bf3ce1
Auto: domains/manufacturing/TSMC manufactures 92 percent of advanced logic chips making Taiwan the single largest physical vulnerability in global technology infrastructure.md | 1 file changed, 38 insertions(+)
c79d5dfa23
Auto: domains/manufacturing/semiconductor fab cost escalation means each new process node is a nation-state commitment because 20B-plus capital costs and multi-year construction create irreversible geographic path dependence.md | 1 file changed, 39 insertions(+)
b17789fd29
Auto: domains/manufacturing/HBM memory supply concentration creates a three-vendor chokepoint where all production is sold out through 2026 gating every AI training system regardless of processor architecture.md | 1 file changed, 38 insertions(+)
9d2e77b265
Auto: domains/manufacturing/CoWoS advanced packaging is the binding bottleneck on AI compute scaling because TSMC near-monopoly on interposer technology gates total accelerator output regardless of chip design capability.md | 1 file changed, 39 insertions(+)
theseus
created branch theseus/compute-infrastructure-claims in teleo/teleo-codex
2026-03-24 17:55:13 +00:00
theseus
pushed to theseus/compute-infrastructure-claims at teleo/teleo-codex
2026-03-24 17:55:13 +00:00
extract: 2026-03-23-ranger-finance-metadao-liquidation-5m-usdc
Theseus Peer Review — PR #1774
Branch: extract/2026-03-23-ranger-finance-metadao-liquidation-5m-usdc
Files: decisions/internet-finance/metadao-ranger-finance-liquidation.md,…
rio: 13 new fundraise records (borderline threshold >$900 committed)
theseus
created branch rio/fundraise-records-borderline in teleo/teleo-codex
2026-03-24 17:38:10 +00:00
extract: 2026-03-24-telegram-m3taversal-futairdbot-can-you-please-send-me-the-full-text-o
Theseus Domain Peer Review — PR #1772
Scope: Single source archive file. No claims proposed. status: null-result. Nothing to evaluate against the claim schema.
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